Microspectrometer

Research : Smart Devices : Discrete Devices : Microspectrometer

Microspectrometer

A miniaturized FTIR spectrometer.

Assembled microsphere with a silicon holder.

Assembled microspectrometer.

Objective:

Development of a miniaturized Fourier transform spectrometer (FTS) which can be used as a hand-held, real-time, and on-site detection mechanism for bio and chemical materials.

Approach:

Integration of heterogeneous 3-dimensional optical system on silicon microoptical bench by combining silicon micromachining and microassembly.
Implementation of a higher resolution spectrometer by a thermally actuating long stroke stage.
Precise positioning and alignment of microoptical components.

Accomplishments:

Implementations of a miniaturized FTS by assembling micromirrors, a ball lens, and beam splitter on SOI silicon die.
Characterization of static and dynamic responses of the scanning mirror mechanism.
Preliminary experiment results show that the spectrum peak was at 632nm with 25nm FWHM using He-Ne laser source and designed stroke amplification that can produce spectral resolution of <10nm in visual wavelength.

Publications:

[1]	P. Zhang, M. Mayyas, W.H Lee, D. Popa, P. Shiakolas, H. Stephanou, and J.C. Chiao, “Active Locking Mechanisms for Assembling 3D Micro Structures,” SPIE Smart Materials, Nano-and Micro-Smart Systems, Adelaide, Australia, December 2006.
[2]	W. H. Lee, D. Popa, J. Sin, V. George, and H. E. Stephanou, “Compliant Microassembly of MEMS,” Sharing Solutions for Emergencies and Hazardous Environments, Utah, February 2006.
[3]	J. Sin, W.H. Lee, D. Popa, and H.E. Stephanou, “Assembled Fourier Transform Micro-spectrometer,” SPIE MOEMS-MEMS, January, San Jose, 2006.
[4]	L.-C. Hsu, V. George, D. Popa, W. H. Lee, M. Mayyas, P. Zhang, H. E. Stephanou, and J. C. Chiao, “3D Microassembly Station,” TexMEMS VII International Conference on Micro Electro Mechanical, El Paso, Texas, September, 2005.
[5]	D. Popa, W.H. Lee, H. E. Stephanou, “Towards New Paradigms for MEMS Assembly,” in Proceedings of SME Automation & Assembly Summit, Saint Louis, April, 2005.
[6]	W. H. Lee, M. Dafflon, H. E. Stephanou, Y. S. Oh, J. Hochberg, and G. D. Skidmore, “Tolerance Analysis of Placement Distributions in Tethered Micro-Electro-Mechanical systems Components,” IEEE Int'l Conf. on Robotics and Automation, May, 2004.
[7]	W. H. Lee, B. H. Kang, Y. S. Oh, H. Stephanou, A. C. Sanderson, G. Skidmore, and M. Ellis, “Micropeg Manipulation with a Compliant Microgripper,” IEEE Int'l Conf. on Robotics and Automation, September, pp. 3213-3218, 2003.
[8]	Y. S. Oh, W. H. Lee, H. E. Stephanou, and G. D. Skidmore, “Design, Optimization, and Experiments of Compliant Microgripper,” ASME Int. Mecha. Eng. Congress & Expo., 2003.