Education:
Ph.D. Howard University, 1984
Areas of Expertise:
Electronic packaging, heat transfer, thermal engineering.
Background:
Dereje Agonafer is Professor of Mechanical and Aerospace Engineering and Director of the Electronics, MEMS and Nanoelectronics Systems Packaging Center at The University of Texas at Arlington.
Dr. Agonafer joined IBM in June 1984 after receiving a PhD from Howard University. At IBM, he worked on the development and application of Computer Aided Thermal Engineering (CATE). He also developed a concurrent engineering methodology for thermo/mechanical design and modeling of electronic packaging. He is a member of the ASME Technical Executive Committee and has served as editor for several journals and book series, including the ASME Journal of Electronic Packaging and the ASME Press Book Series in Electronics. He has chaired several conferences, including the ASME Electrical and Photonic Packaging Division in 2000, ITHERM (Intersociety Conference on Thermal and Thermo Mechanical Phenomena in Electronic Systems) in 1994 and 1996, and InterPACK (The Pacific Rim/ASME International, Intersociety Electronic and Photonic Packaging Conference) in 1999.
Dr. Agonafer is a Fellow of the American Society of Mechanical Engineers International and a member of The Howard University Board of Visitors to the School of Engineering. He has received numerous awards, including the ASME International Electronic and Photonic Packaging Division Highest Division Award for Outstanding Contributions to the Area of the Application of the Science and Engineering of Heat Transfer to Electronic and Photonic Packaging and the IBM Outstanding Technical Achievement Award in Appreciation for Computer Aided Thermal Modeling.
Contact:
agonafer@uta.edu |
