Research : Micromanufacturing : Robotic Assembly : Multiscale & Modular Robotics

Multiscale & Modular Robotics

Objective:

To develop a systematic methodology for designing automated machines that enable assembly and packaging of small-scale systems. These multiscale robots operate across scales from macro to nano, and their design is guided by a set of hierarchical precision principles. They target low-volume pilot production of sensors, actuators, and other heterogeneous microdevices by using reconfigurable and modular hardware and software.

Approach:

• We use a multiscale, top-down approach to bridge the scale gap based on:
  - Part size: Macro (cm) – Meso (mm) - Micro – (µm) – Nano (nm)
  - Robot size: Macro (m) – Meso (cm) – Micro (mm) – Nano (µm)
  - Robot accuracy: Meso (mm) – Micro (µm) – Nano (nm)
• We use a variety of technologies for micro sensing and actuation:
  - Si, PZT, and Metal MEMS, such as SOI DRIE, MUMPS.
  - Other non-silicon microsystems: glass, SMA, plastics, LIGA.
• M³ is a multiscale robotic tool for small-scale device manufacturing with a workspace of several cubic feet, and is used to assemble and package devices with cm to mm part sizes and mm tolerances. M³ is currently used for the automated production of S&A microdevices at the Bennington Microtechnology Center in Vermont.
• µ³ is a multiscale robotic tool for small-scale device manufacturing, with a several cubic centimeter workspace and is used to assemble devices with mm to µm part sizes and nm tolerances. µ³ is used in the assembly of wafer-level microrobots, S&A MEMS, and optical bench on a chip devices such as microspectrometers, optical attenuators, etc.
• Dimensional and throughput gaps between the micro and nano scales are covered by the N³ wafer scale microfactory containing arrays of microrobots assembled by µ³ and packaged by M³.
  

Accomplishments:

• Prototyping of modular systems for the assembly and packaging of MEMS:
  - Off-the-shelf and custom hardware combined to obtain a multiscale precision assembly system.
  - Macro and micromanipulation robotic platforms used in conjunction with machine vision, a supervisory control system, process tools such as a diode laser, and a variety of fixtures and end-effectors customized for each assembly task.
  - Robot end-effectors mounted using tool-changer adapters used to perform pick, place, and alignment operations of micro and meso scale parts.
• Hardware & software architecture handles both bonding processes and manipulation of microcomponents allowing for:
  - Modularity and reconfigurability.
  - A number of standard process capabilities, in particular fluxless die and fiber attach.
  - Yield-aware prototyping of non-electronic IC devices such as MEMS, MOEMS and microfluidics.
  - Task-oriented control and vibration suppression to attain fine positioning.
  - Multiple manipulators share a common workspace.
• System software implemented in Labview™ , is responsible for:
  - Manipulator calibration, inverse kinematics.
  - Vibration-free trajectory planning.
  - Assembly and packaging sequence execution.
  - Exception handling and yield monitoring.
  - Visual servoing and microscope assisted calibration.
  - Collision avoidance.
• Systematically use fixtures, calibration, inverse kinematics and visual servoing to achieve the necessary levels of precision across multiple scales. Use of assembly primitives and workspace mapping to required accuracy levels so that the assembly sequence can be planned entirely in software.

Applications:

• Automated assembly for fiber-optics, MOEMS and MEMS components.
• Devices such as micro-optical benches, WDM components, NxN fiber arrays.
• Assembly and packaging of discrete microfluidics.

Publications:

Related Topics :
Robotic Assembly :
Microrobotics
Multiscale & Modular Robotics
Active Surfaces