Microrobotics

Microassembly System
Microassembly System

The µ³ assembly system, shown above, consists of three nanomanipulators with a total of 19 degrees of freedom. The system footprint is small enough to fit inside an SEM.

Microgrippers and microfasteners are used in automated assembly of a multitude of microdevices. The actuators include both precision servo stages, as well as piezo-driven stages that allow for a 10nm maximum resolution.

The µ³ software is written in Labview™ and follows a clear set of multiscale design principles.

 

 

 

 

 

Objective:

Cost effective precision assembly of heterogeneous micro and nano systems. At high assembly yields, this technology is a viable alternative to monolithic fabrication. MEMS microrobots are also a viable top-down pathway to nanomanufacturing.

Approach:

Two-prong approach based on:

  • A meso-micro-nano assembly platform for MEMS millimeter to micron part sizes and nanometer tolerances. This platform uses microrobots built on a wafer.
  • A micro-nano assembly system built using these microrobots.

Grippers, Fasteners

MEMS grippers and fasteners made from various materials are used to assemble cm-size complex MEMS such as the micro-spectrometer die shown above.


Accomplishments
:

  • Microgripper, passive and active micro snap-fastener technology for MOEMS assembly.
  • Successful assembly of heterogeneous MEMS and MOEMS: interferometer, spectrometer, safe & arm devices, fiber arrays, fiber interconnects, PIN diodes, and many others.
  • Reliable automated handling of parts with dimensions as low as tens of microns, and sub-micron feature sizes.
  • Modeling and motion control for electrostatic and thermal MEMS.
  • Significant performance improvement of MEMS devices via open or closed loop control. Input shaping and closed-loop control of MEMS with applications in VOA, MEMS switching and other optical and RF-MEMS.

Publications:

[1]

Borovic, B.; Lewis, F.L.; McCulley, W.; Al Qun Liu; Kolesar, E.S.; Popa, D.O., “Control issues for microelectromechanical systems,” Control Systems Magazine, IEEE, Volume 26, Issue 2, April 2006 Page(s):18 – 21.

[2]

B. Borovic, F. L. Lewis, D. Agonafer, E. S. Kolesar, M. M. Hossain, D. O. Popa, Method for Determining a Dynamical State-Space Model for Control of Thermal MEMS Devices, Journal of Microelectromechanical Systems, Vol. 14, Issue 5, Nov. 2005.

[3]

B. Borovic et. al., Open-loop vs closed-loop control of MEMS devices: choices and issues, J. Micromech. Microeng. 15 (2005) 1917-1924.

[4]

D.O. Popa, H. E. Stephanou, “Micro and Meso Scale Robotic Assembly”, in SME Journal of Manufacturing Processes, vol. 6 No. 1, 2004, 52-71.

[5]

W. H. Lee, D.O. Popa, J. Sin, V. George, H.E. Stephanou, “Compliant Microassembly of MEMS,” in proc. of ANS Conference Sharing Solutions for Emergencies and Hazardous Environments, Salt Lake City, Utah, February 2006.

[6]

W. H. Lee, B. H. Kang, Y. S. Oh, H. Stephanou, A. C. Sanderson, G. Skidmore, and M. Ellis, “Micropeg Manipulation with a Compliant Microgripper,” IEEE Int'l Conf. on Robotics and Automation, September, pp. 3213-3218, 2003.

[7]

Y. S. Oh, W. H. Lee, H. E. Stephanou, and G. D. Skidmore, “Design, Optimization, and Experiments of Compliant Microgripper,” ASME Int. Mecha. Eng. Congress & Expo., 2003.

[8]

Popa, D.O.; Kang, B. H.; Wen, J.T.; Stephanou, H.E.; Skidmore, G.; Geisberger, A.;, “Dynamic Modeling and Open-Loop Control Of Thermal Bimorph MEMS Actuators,” in Proc. IEEE Conf. on Robotics and Automation, Taipei, Taiwan, 2003.

[9]

R. Murthy, A.N. Das, D. O. Popa, “Multiscale Robotics Framework for MEMS Assembly,” to appear in Proceedings of the Ninth International Conference on Control, Automation, Robotics and Vision (ICARCV), Singapore, Dec 2006.

[10]

N. Dhaubanjar, S. M. N. Rao, Y. Cai, D.O. Popa, M. Chiao, J.-C. Chiao¬ “A Cantilever-type Electrostatic Zipping Actuator”, SPIE International Smart Materials, Nano- & Micro-Smart Systems Symposium, Adelaide, Australia, Dec.10-13 2006.

[11]

N.Dhaubanjar, S. M. N. Rao, H.L.-Chen, M. Luquire, D. O. Popa, M. Chiao, H. Stephanou, J.-C. Chiao¬, “Investigation of Vertical Displacement Thermal Actuators,” SPIE International Smart Materials, Nano- & Micro-Smart Systems Symposium, Adelaide, Australia, Dec.10-13 2006.

[12]

P. Zhang, M. Mayyas, W.H. Lee, D. O. Popa, P. Shiakolas, H. Stephanou, J. C. Chiao, “An Active Locking Mechanism for Assembling 3D Micro Structures,” SPIE International Smart Materials, Nano- & Micro-Smart Systems Symposium, Adelaide, Australia, Dec.10-13 2006.

[13]

Mayyas, M.; Shiakolas, P. ; Lee, W. H.; Popa, D.O.; Stephanou, E.H.; "Static and dynamic modeling of thermal microgripper," MED06-14th Mediterranean Conference in Automation and Control, Ancona, Italy, June 2006.

[14]

M.A. Mayyas, W.H. Lee, D.O. Popa, P. Shiakolas, P. Zhang, H. E. Stephanou. "Comprehensive Electrothermal Modeling of a Thermal Microgripper,” TEXMEMS VII International Conference on MEMS, El Paso, TX, September 2005.

[15]

D. O. Popa, et. al., “Computationally Efficient Dynamic Modeling of MEMS”, in Proc of 7-th Int’l Conf. on Modeling and Simulation of Microsystems, March 2004.

[16]

D. O. Popa, et. al., “Dynamic Modeling and Input Shaping for MEMS”, in Proc of 7-th Int’l Conf. on Modeling and Simulation of Microsystems, March 2004.

[17]

J. Sin, D. O. Popa, and H.E. Stephanou, “Model Based Automatic Fiber Alignment”, in Proc. of SMTA Nepcon West Conference, San Jose, CA, Dec. 2002.

[18]

D. O. Popa, H.E Stephanou, “M3 and Mu3 Robotic Tools for Small-Scale Manufacturing,” invited presentation at 2006 US Navy Workshop on Transduction Materials and Devices, State College, PA, May 2006.

[19]

D. O. Popa, "Micro and Meso Scale Robotic Assembly", invited presentation at SME Micromanufacturing Conference, Los Angeles, March 2006.

[20]

L.C. Hsu, V. George, D.O. Popa, W.H. Lee, M. Mayyas, P. Zhang, H. Stephanou, J.C. Chiao. "3D Microassembly Station,” in Proceedings of TexMEMS VII, El Paso, Texas, September 2005.

[21]

D. O. Popa, "Toward New Paradigms in MEMS Assembly," in SME Automation & Assembly Summit, St. Louis, April 19-20 2005.

[22]

D. O. Popa, et. al., “Microassembly of MEMS Components: Concepts and Experiments”, TEXMEMS VI Conference, Texas A&M, September 2004.

[23]

D. O. Popa, et. al., “New Approaches to Modeling, Simulation and Control for MEMS”, TEXMEMS VI Conference, Texas A&M, September 2004.

[24]

J. Sin and H.E. Stephanou, “A Parallel Micromanipulation Method for Microassembly,” SPIE Conference on Micromachining and Microfabrication, 2001, pp.158-164.

[25]

J. Sin, and H.E. Stephanou, “Semi-Distributed Manipulation on a Friction Force Field,” Proceedings of IEEE/RSJ International Conference on Intelligent Robots and Systems, 2001, pp.220-225.

[26]

J. Sin, T. Winther, and H.E. Stephanou, “Micromanipulation Using a Friction Force Field,” Proceedings of IEEE International Conference on Robotics and Automation, 2001, pp.115-120.

Related Topics :
Robotic Assembly :
Microrobotics
Multiscale & Modular Robotics

Microrobotics

 

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