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| Solder ball with Cu pad with Cu-Sn
intermetallic layers. |
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Overview
We are working on a family of reliability
studies of micro-electronic and MEMS devices. Major research
is been done at ARRI on microsystem design for reliability,
hermetic packaging, and characterization of Lead-free
solders.
Current Projects :
- Analysis of Lead-free solders for
Electronic devices.
- Shear/tensile/vibration testing of MOEMS and microfluidic
devices.
- Reliability of fluxless soldering for hermetic packaging.
Experimental Capabilities :
Temperature Cycling
Testing:
Purpose of this test is to demonstrate that boards can
withstand non-operating (i.e. storage) high temperature,
low temperature, and numerous thermal cycles. The test
combines high temperature storage, low temperature
storage, and thermal shock conditions. At ARRI we are
capable of performing experiments as per:
- JEDEC
standard
Board level -40 to 125C
Package level -50 to 150C
- Military standard
-65 to 155C
Humidity Penetration Testing:
Purpose of this test is to demonstrate product resistance
to humidity problems in non-operating storage environments.
A leak test is performed using a mass-spectrometer
and He tracer gas.
Tensile Testing:
Purpose of this test is to determine the tensile
strength of the package under consideration. This test
is performed using an Instron Micro Tester.
Shear Testing:
Purpose of this experiment is to determine the Shear
strength of the package under consideration. This test
is performed using Instron Micro Tester.
Other Experimental Capabilities:
- 4 point bending Test
- Vibration
Test
- Fatigue Test
- Creep Test
Publications:
[1] |
"Design for Stackability of Flash Memory Devices Based on Thermal Optimization", Akhter, Roksana, Sandur, Bhavani P.D., Hossain, Mohammad, Kaisare, Abhijit, and Agonafer, Dereje, Proceedings of 24th Digital Avionics Systems Conference, Washington, D.C., October 30 – November 3, 2005. |
[2] |
"Thermal Road map for Telecom Equipment," Refai-Ahmed, Gamal, Agonafer, Dereje, ASHRAE Transactions, v 111 n 1, 2005, p 913-920. |
[3] |
"Thermal Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die," Kaisare, Abhijit, Agonafer, Dereje, Haji-Sheikh, A., Chrysler, Greg, and Mahajan, Ravi, InterPACK'05, San Francisco, CA, July 17-22, 2005. |
[4] |
"Effect of Continuous and Discontinuous Fabrication and Reflow Process on PWB Warpage," Karajgikar, Saket, Ahn, Wonkee, and Agonafer, Dereje, InterPACK'05 Conference, San Francisco, CA, July 17-22, 2005. |
[5] |
"Lead-Free and Sn/Pb Solders Alloy Behavior under Cyclic Bending," Hossain, Mohammad, Agonafer, Dereje, Puligandla, Viswanadham, and Reinikainen, Tommi, InterPACK'05, San Francisco, CA, July 17-22, 2005. |
[6] |
"Methodology for an integrated (electrical/mechanical) design of PWBA", Ahn, Wonkee; Agonafer, Dereje; Novotny, Shlomo, Journal of Electronic Packaging, Transactions of the ASME, v 126, n 4, December, 2004, Thermal Management of Electronic Systems: Four Decades of Progress, p 524-527. |
[7] |
"A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending", Xu, Leon (NOKIA Inc., MS 3-4-1400); Reinikainen, Tommi; Ren, Wei; Wang, Bo Ping; Han, Zhenxue; Agonafer, Dereje, Microelectronics Reliability, v 44, n 12, December, 2004, p 1977-1983. |
[8] |
"Strain based approach for predicting the solder joint fatigue life with the addition of intermetallic compound using finite element modeling", Hossain, Mohammad M; Agonafer, Dereje; Viswanadham, Puligandla; Reinikainen, Tommi, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 2, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, p 358-367. |
[9] |
A. Fasoro, D.O. Popa, A. Patil, W. Lee, J. Sin, and H. Stephanou, “Fluxless Soldering for Hermetic Packaging of MOEMS,” in proc. of IMAPS International Conference, San Diego, October 2006. |
[10] |
A. Fasoro, A. Patil, D. O. Popa, H. Beardsley, D. Agonafer and H. Stephanou, “Fluxless soldering of MOEMS,” ITHERM Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, May, 2006. |
[11] |
A. Fasoro, D. O. Popa, A. Patil, W. Lee, J. Sin, and H. Stephanou, “Fluxless Soldering for Hermetic Packaging of MOEMS,” IMAPS International Conference and Exhibition on Device Packaging, Scottsdale, Arizona, March 2006. |
[12] |
D.O. Popa, M. Deeds, A. Fasoro, H. Beardsley, J. Sin, W. Lee and R. Fernandez, “Automated Assembly and Hermetic Packaging of MOEMS for Applications Requiring Extended Shelf-Lives,” IMECE2005, 2005 ASME International Mechanical Engineering Congress and Exposition, November 2005. |
[13] |
A. Fasoro, A. Patil, W. Lee, J. Sin, H. Beardsley, D. O. Popa and H. Stephanou, "Fluxless Soldering of MOEMS," TEXMEMS VII International Conference on MEMS, El Paso, TX, September 2005. |
Related Topics
:
Micropackaging :
3D
Packaging
Reliability
Microfluidics
|
