Microfluidics

Research : Micromanufacturing : Micropackaging : Microfluidics

Microfluidics

An assembled flexible microfluidic circuit

Y-shape channel for laminar flow mixer

PDMS adapter for microfluidics.

Overview:

Modular microfluidic circuits & interconnections for multipurpose applications in life science, chemistry, BioMEMS, and Lab-on-Chip devices.

Approach:

Low cost flexible substrates using polymer molding.
Embedded microvalves to measure fluid volume, direct flow and sequence discrete flow control.
Reconfigurable circuit construction by assembly of modular components on a platform substrate.


Microvalve embedded in substrate	Before the valve is actuated	After the valve is actuated

Accomplishments:

Publications:

[1]	A. Kole, K. Bushan, J. Sin, W.H. Lee, D. O. Popa, D. Agonafer, H.E. Stephanou. "Polymer Tube Embedded In-Plane Micropump,” TEXMEMS VII International Conference on MEMS, El Paso, TX, September 2005.
[2]	Kole, A.; Jeongsik Sin; Woo Ho Lee; D. O. Popa; Agonafer, D.; Stephanou, H.;” Design of polymer tube embedded in-plane micropump,” Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on May 30-June 2, 2006 Page(s):1324 – 1329.
[3]	Kole, A.; Sin, J.; Lee, W.-H.; Popa, D.; Agonafer, D.; Stephanou, H.;” Polymer tube embedded in-plane micropump for low flow rate,” Digital Avionics Systems Conference, 2005, DASC 2005. The 24th, Volume 2, 30 Oct.-3 Nov. 2005 Page(s):7 pp. Vol. 2.
[4]	S.M.N.Rao, A. Mhatre, D. O Popa, J. C. Chiao, T. Ativanichayaphong, J. Sin, H.E. Stephanou, "MEMS-based Implantable Drug Delivery System", TEXMEMS VII International Conference on MEMS, El Paso, TX, September 2005.
[5]	A.S. Kole, J. Sin, W.H. Lee, D. Popa, D. Agonafer, and H.E. Stephanou, “Polymer Tube Embedded In-Plane Micropump: Design, Analysis and Fabrication,” ASME International Mechanical Engineering Congress and Exposition, 2005.
[6]	J. Sin, W.H. Lee, and H.E. Stephanou, “In-Plane Micropump: Modeling and Optimization,” NanoTechology 2004, pp.271-274.
[7]	T.J. Hwang, D. Popa, J. Sin, H.E. Stephanou, and E.M. Leonard, “BCB Wafer Bonding for Microfluidics,” SPIE Conference on Micromachining and Microfabrication, 2004.