 |
| Optical 3D Profiler image of a reflown
electrical interconnect. |
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| Patterned silicon wafer with microfluidic
channels. |
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| Laurier Die Bonder in the Texas Microfactory™ used
to form 3D interconnects. |
|
Overview:
Develop novel methods for the compact
and reliable packaging of microdevices, thus enabling
heterogeneous and multifunctional integration.
Approach:
- Wafer and die-level stacking and interconnects of
electronics, MEMS, optics, and fluidics.
- Vertical interconnects between stacks including
electrical, fluidic and optical connectivity.
- Multifunctional integration of components enables
modular architectures.
Simultaneous BCB wafer bonding
and 3D interconnect formation.
Accomplishments:
- Wafer bonding using BCB for microfluidic packaging.
Die stacking using fluxless soldering.
- Simultaneous bonding and interconnects using BCB
and SnAu microbumps.
- Packaging of microdevices such as implantable drug
delivery systems and S&A devices.
Stacked dies/wafers result in a
smaller “footprint” and better performance.
Publications
[1] |
A. Fasoro, D.O. Popa, A. Patil, W. Lee, J. Sin, and H. Stephanou, “Fluxless Soldering for Hermetic Packaging of MOEMS,” in proc. of IMAPS International Conference, San Diego, October 2006. |
[2] |
D.O. Popa, R. Murthy, J. Sin, M. Mittal, H.E. Stephanou, “M3: Modular Microassembly System for MEMS Packaging,” in proc. of IMAPS International Conference, San Diego, October 2006. |
[3] |
P. Pandojirao-Sunkojirao, R. Dewan, D. O. Popa, J.C. Chiao, “Electrical Interconnects for 3D Wafer Stacks,” in proc of IMAPS International Conference, San Diego, October 2006. |
[4] |
A. Fasoro, A. Patil, D. O. Popa, H. Beardsley, D. Agonafer and H. Stephanou, “Fluxless soldering of MOEMS,” ITHERM Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, May, 2006. |
[5] |
T.J. Hwang, D. O. Popa, Y. Oh, J. Sin, and H. Stephanou, “BCB as a Protective and Bonding Layer on Photosensitive Glass”, in Proceedings of the SPIE Conference on Micromachining and Microfabrication, January 2004. |
[6] |
D. O. Popa, T.J. Hwang, J.Q. Lu, B.H. Kang, and H. Stephanou, “BCB Wafer Bonding Compatible with Bulk Micro machining”, in Proc. of Int’l Electronic Packaging Technical Conference and Exhibition, INTERPACK ’03, Maui, Hawaii, July 2003. |
[7] |
P. Pandojirao-Sunkojirao, R. Dewant, D. O. Popa, J.C. Chiao, “BCB Wafer Bonding with Electrical Interconnects,” to appear in proc. Of SMTA IWLPC 3D Wafer-Scale Conference, San Diego, November 2006. |
[8] |
P. Pandojirao-Sunkojirao, P. Zhang, R. Dewan, D. O. Popa, H.E. Stephanou, J.C. Chiao, “Electrical Interconnects for 3D Wafer Stacks,” in proc of IMAPS International Conference and Exhibition on Device Packaging, Scottsdale, Arizona, March 2006. |
[9] |
A. Fasoro, D. O. Popa, A. Patil, W. Lee, J. Sin, and H. Stephanou, “Fluxless Soldering for Hermetic Packaging of MOEMS,” IMAPS International Conference and Exhibition on Device Packaging, Scottsdale, Arizona, March 2006. |
[10] |
D.O. Popa, M. Deeds, A. Fasoro, H. Beardsley, J. Sin, W. Lee and R. Fernandez, “Automated Assembly and Hermetic Packaging of MOEMS for Applications Requiring Extended Shelf-Lives,” IMECE2005, 2005 ASME International Mechanical Engineering Congress and Exposition, November 2005. |
Related Topics
:
Micropackaging :
3D
Packaging
Reliability
Microfluidics
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