Fundamental MEMS, an Introduction to

Microelectromechanical Systems (MEMS)

 

Course advertisement

 

 

Texas Christian University

Course ENGR 40970

 

 

The University of Texas at Arlington

Course EE 5349/4328

 

Time and location

TTh 3:30 - 5:20 p.m., Nedderman Hall, Room 105

Summer Semester, 2002

28 May – 9 August

Instructors

Edward S Kolesar, Ph.D., P.E., W.A. Moncrief Professor of Engineering

Department of Engineering

Tucker Technology Center, Room 212

Texas Christian University, Fort Worth, TX 76129

tel:  (817) 257-6226; -7126

fax:  (817) 257-7704

email:  e.kolesar@tcu.edu

Office hours: by appointment.

 

Frank L. Lewis, Ph.D., P.E., Moncrief-O’Donnell Endowed Chair

Department of Electrical Engineering

Automation and Robotics Research Institute (ARRI)

The University of Texas at Arlington

7300 Jack Newell Blvd. South

Fort Worth, Texas 76118-7115

tel. 817-272-5972

fax. 817-272-5989

email: flewis@controls.uta.edu

Office hours: by appointment.

RA/TA

José Mireles Jr.

Automation and Robotics Research Institute (ARRI)

The University of Texas at Arlington

7300 Jack Newell Blvd. South

Fort Worth, Texas 76118-7115

tel. 817-272-5955

fax. 817-272-5989

email:  jmireles@arri.uta.edu

Office hours: by appointment.

 

Syllabus

 

Streaming videos (choose MEMS TCU Section)

 

Project, template

 

Homework policy & due dates

 

Course schedule (use Acrobat reader 4.0, or later version):

May 28

Introduction: history of MEMS, market for MEMS, overview of MEMS processes, properties of silicon, a sample MEMS process.
Handouts:
class syllabus, silicon crystal origami, Petersen’s, Feynman’s.
Lecture Notes:
Lecture 1.

May 30

Basics of Microtechnology: definitions and terminology, a sample process, lithography and etching.
Handouts:
Homework 1

References:  "There's Plenty of Room at the Bottom" by Richard Feynman (reprinted in Journal of Microelectromechanical Systems, March 1992); "Silicon as a Mechanical Material" by Kurt Petersen (Proceedings of the IEEE, May 1982).
Lecture Notes:
Lecture 2.

June 4

MEMS Biosensors:
Handouts: Bio Flow Sensors, MEMS Images. Answer SCREAM..
Lecture Notes:
none.

June 6

Introduction to MEMS Pro design software.
Handouts: Following material is MEMScAP ©: MEMSPro tutorial.
Lecture Notes:  Following material is MEMScAP ©: MEMS Pro Overview, Layout Prsnt, Layout Tutorial, System Lvl Prsnt., System Lvl Tutorial, ANSYS Add-Ons, ANSYS MEMS, DRC Tutorial.

June 11

Micromachining: subtractive processes (wet and dry etching), additive processes (evaporation, sputtering, epitaxial growth).
Handouts: none.
Lecture Notes:
Lecture 3.

June 13

Fundamental Devices and Processes: basic mechanics and electrostatics for MEMS, parallel plate actuators, pull-in point, comb drives.
Handouts:
Homework 2, due Homework 1.

References:  "Laterally Driven Polysilicon Resonant Microstructures" by W. C. Tang, T.-C. H. Nguyen, and R. T. Howe (Proc. IEEE MEMS, February 1989); "Electrostatic-Comb Drive of Lateral Polysilicon Resonators" by W. C. Tang, T.-C. H. Nguyen, M. W. Judy, and R. T. Howe (Transducers, June 1989).
Lecture Notes:
Lecture 4.

June 18

Fundamental Devices and Processes: more electrostatic actuators; MEMS foundries, Cronos MUMPs (multi user MEMS process).
Handouts: none.
Lecture Notes:
Lecture 4.

June 20

MUMPs Multi User MEMS Process: review Tang et al. papers; JDS Uniphase MUMPs processing sequence and design rules.
Handouts:
MUMPs Design Handbook Chapter 1 (pp. 1-9), Laterally driven paper , Electrostatic comb drive actuator paper.
Lecture Notes:
Lecture 5.                

June 25

MUMPs and SUMMiT: design rules; applications; micro hinges and deployment actuators.

Handouts: none.
References: 
Elliot E. Hui, Roger T. Howe, and M. Steven Rodgers, "Single-Step Assembly of Complex 3-D Microstructures," Proc. IEEE 13th Int'l Conf. on Micro Electro Mechanical Systems (Miyazaki, Japan, January 23-27, 2000), pp. 602-607.
M. Parameswaran, H.P. Baltes, A.M.Robinson, "Polysilicon Microbridge Fabrication Using Standard CMOS Technology," IEEE Solid-State Sensor and Actuator Workshop, pp. 148-150, June 1988 (reprinted in Micromechanics and MEMS, IEEE Press 1997).
Lecture Notes:
Lecture 6.

June 27

CMOS MEMS: CMOS foundry processes, integrated IC/MEMS, MEMS postprocessing, applications.
Handouts:
Homework 3, due Homework 2.
Lecture Notes:
Lecture 7.

July 2
 

Cleanroom lab techniques: clean rooms, gowning procedures; safety, fire, toxicity; acids and basis; photolithography.
Handouts: none.
Lecture Notes: Lecture packaging,
Lecture 8.


Project proposals due.

July 9

Thermal Transducers: bimorphs, "heatuators", cilia arrays.

Handouts: none.
References:  Rebecca Cragun, Larry L. Howell, "Linear Thermomechanical Microactuators," Proc. ASME IMECE 1999, pp. 181-188.
Lecture Notes:
Lecture 9.

July 11

MicroOptoElectroMechanical Systems (MOEMS): micro scanners, digital mirror display, retinal scanning display.

Handouts: none.
References: "Electrostatic combdrive-actuated micromirrors for laser-beam scanning and positioning" by Meng-Hsiung Kiang; Solgaard, O.; Lau, K.Y.; Muller, R.S., Journal of Microelectromechanical Systems 7(1):27-37, March 1998.*
Lecture Notes: 
Lecture 10.

July 16    

MicroOptoElectroMechanical Systems (MOEMS): grating light valve, corner cube retroreflector, optical switches, other micro-optical devices.
Handouts: Assignment#3 is due.  Assignment #4: cover, page 1, page 2, page 3.

Lecture Notes:  Lecture 11

July 18

. Piezoresistivity; Scanning Probe Microscopy: scanning tunneling microscope (STM), atomic force microscope (AFM).
Handouts: none.
Lecture Notes: Lecture 12
.

July 23

Scaling Laws;  Midterm Examination review and Q&A.
Handouts: none.
Lecture Notes:  Lecture 13.

July 25

Midterm exam

July 30

Wireless MEMS: mechanical and electrical resonators, Q-factor, switches, filters.
Handouts: none.
Lecture Notes: Lecture 14.

August 1

Power for MEMS: thin film batteries, micro fuel cells, energy fields, ...
Handouts: none.
Lecture Notes: Lecture 15.
Project design reviews due.

August 6

MEMS Packaging and Assembly: microassembly: serial and parallel, deterministic and stochastic; microgrippers: HexSil process; packaging techniques.
Handouts: none.
Lecture Notes: Lecture 16.

August 8

The Future of MEMS: bioMEMS - neural implants, gene chips, diagnostic chips; MEMS in space; mechanical computers; invisible and ubiquitous computing.

Project summaries due:  Approximately 4 pages, conference paper style; describe the underlying ideas, the performed work, the obtained results, and your conclusions (check template above main schedule).
Handouts: none.
Lecture Notes: Lecture 17.

 

Solutions Hmk#1:  Minimum solution, Good solutions:  soln1, soln2, soln3, soln4.

Solution Hmk#2.  Instructor’s solution.

Solution Hmk#3.  Instructor’s solution.

Paper needed for assignment 4. Some equations needed.  Bimorph cantilever equation.

MEMSPro help for project.

Solution Hmk#4.  Cvp, p1, p2, p3, p4, p5, p6, p7, p8, p9, p10, p11, p12, paper.

 

         Murad’s project

 

Last change made by 8/09/02

This page is maintained by José Mireles Jr.  jmireles@arri.uta.edu